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 PD - 91682A
IRG4PSC71UD
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
Features
* Generation 4 IGBT design provides tighter parameter distribution and higher efficiency (minimum switching and conduction losses) than prior generations * IGBT co-packaged with HEXFRED ultrafast, ultrasoft recovery anti-parallel diodes for use in bridge configurations * Industry-benchmark Super-247 package with higher power handling capability compared to same footprint TO-247 * Creepage distance increased to 5.35mm
C
UltraFast CoPack IGBT
VCES = 600V
G E
VCE(on) typ. = 1.67V
@VGE = 15V, IC = 60A
n-cha n ne l
Benefits
* Generation 4 IGBT's offer highest efficiencies available * Maximum power density, twice the power handling of TO-247, less space than TO-264 * IGBTs optimized for specific application conditions * HEXFRED diodes optimized for performance with IGBTs * Cost and space saving in designs that require multiple, paralleled IGBTs
SUPER - 247
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25C IC @ TC = 100C ICM ILM IF @ TC = 100C IFM VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Diode Continuous Forward Current Diode Maximum Forward Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec.
Max.
600 85 60 200 200 60 350 20 350 140 -55 to +150 300 (0.063 in. (1.6mm) from case)
Units
V
A
V W
C
Thermal Resistance\ Mechanical
Parameter
RJC RJC RCS RJA Junction-to-Case - IGBT Junction-to-Case - Diode Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Recommended Clip Force Weight
Min.
--- --- --- --- 20.0(2.0) ---
Typ.
--- --- 0.24 --- --- 6 (0.21)
Max.
0.36 0.69 --- 38 --- ---
Units
C/W
N (kgf) g (oz)
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1
5/12/99
IRG4PSC71UD
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
Parameter Min. Typ. Collector-to-Emitter Breakdown Voltage 600 --- V(BR)CES/TJ Temperature Coeff. of Breakdown Voltage --- 0.39 VCE(on) Collector-to-Emitter Saturation Voltage --- 1.67 --- 1.95 --- 1.71 VGE(th) Gate Threshold Voltage 3.0 --- VGE(th)/TJ Temperature Coeff. of Threshold Voltage --- -13 gfe Forward Transconductance 47 70 ICES Zero Gate Voltage Collector Current --- --- --- --- VFM Diode Forward Voltage Drop --- 1.4 --- 1.3 IGES Gate-to-Emitter Leakage Current --- --- V(BR)CES Max. Units Conditions --- V VGE = 0V, IC = 250A --- V/C VGE = 0V, IC = 10mA 2.0 IC = 60A VGE = 15V --- IC = 100A See Fig. 2, 5 V --- IC = 60A, TJ = 150C 6.0 VCE = VGE, IC = 250A --- mV/C VCE = VGE, IC = 1.5mA --- S VCE = 50V, IC = 60A 500 A VGE = 0V, VCE = 600V 13 mA VGE = 0V, VCE = 600V, TJ = 150C 1.7 IC = 60A See Fig. 13 V --- IC = 60A, TJ = 150C 100 nA VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Ets LE Cies Coes Cres trr Irr Qrr di(rec)M/dt During tb Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge Diode Peak Rate of Fall of Recovery Min. --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. 340 44 160 90 94 245 110 3.26 2.27 5.53 91 88 353 150 7.1 13 7500 720 93 82 140 8.2 13 364 1084 328 266 Max. Units Conditions 520 IC = 60A 66 nC VCC = 400V See Fig. 8 240 VGE = 15V --- TJ = 25C --- ns IC = 60A, VCC = 480V 368 VGE = 15V, RG = 5.0 167 Energy losses include "tail" and --- diode reverse recovery. --- mJ See Fig. 9, 10, 11, 18 7.2 --- TJ = 150C, See Fig. 9, 10, 11, 18 --- ns IC = 60A, VCC = 480V --- VGE = 15V, RG = 5.0 --- Energy losses include "tail" and --- mJ diode reverse recovery. --- nH Measured 5mm from package --- VGE = 0V --- pF VCC = 30V See Fig. 7 --- = 1.0MHz 120 TJ = 25C See Fig. ns 210 TJ = 125C 14 IF = 60A 12 TJ = 25C See Fig. A 20 TJ = 125C 15 VR = 200V 546 TJ = 25C See Fig. nC 1625 TJ = 125C 16 di/dt = 200A/s --- TJ = 25C See Fig. A/s --- TJ = 125C 17
2
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IRG4PSC71UD
80
F or b oth:
LOAD CURRENT (A)
60
D uty c y c le : 50 % T J = 12 5 C T sink = 90 C G a te d riv e a s s pe c ified
P ow er D is s ipation = 58 W S q u a re w a v e :
40
60% of rated voltage
I
20
Id e a l d io d es
0 0.1 1 10 100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
1000
I C , Collector Current (A) Ic , Collector-to-Emitter Current (A)
TJ = 25 C TJ = 150 C
I C , Collector-to-Emitter Current (A)
TJ = 150 C
100
100
TJ = 25 C
10
10
1 1.0
V GE = 15V 80s PULSE WIDTH
1.5 2.0 2.5 3.0 3.5
1 5 6 7
V CC = 50V 5s PULSE WIDTH
8 9 10
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4PSC71UD
100
3.0
LIM ITE D B Y P A C K A G E
Maximum DC Collector Current (A)
80
VCE , Collector-to-Emitter Voltage(V)
VGE = 15V 80 us PULSE WIDTH
IC = 120 A
60
2.0
40
IC = 60 A IC = 30 A
20
V GE = 15V
0 25 50 75 100 125
A
150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , C a s e T e m p e ra tu re (C )
TJ , Junction Temperature ( C)
Fig. 4 - Maximum Collector Current vs. Temperature
Case
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
1
Thermal Response (ZthJC)
D = 0.50
0.1
0.20 0.10 0.05 0.02 0.01
P DM
S IN G LE P U LS E (TH E R M A L R E S P O N S E )
t1 t2
Notes: 1. Duty factor D = t
1 / t2
0.01 0.0001
2. Peak TJ = PDM x Z thJC + TC
A
100
0.001
0.01
0.1
1
10
t 1 , R e cta n g u la r P u ls e D u ra tio n (s e c)
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PSC71UD
14000
12000
VGE , Gate-to-Emitter Voltage (V)
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 60A
16
C, Capacitance (pF)
10000
Cies
8000
12
6000
Coes
4000
8
2000
Cres
4
0 1 10 100
0 0 100 200 300 400
VCE , Collector-to-Emitter Voltage (V)
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
12.0
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
100
10.0
Total Switching Losses (mJ)
Total Switching Losses (mJ)
V CC V GE 11.0 TJ IC
= 480V = 15V = 25 C = 60A
RG = 5.0 5.0Ohm VGE = 15V VCC = 480V IC = 120 A
9.0
10
8.0
IC = 60 A
7.0
IC = 30 A
6.0
5.0 0 10 20 30 40 50
1 -60 -40 -20
0
20
40
60
80 100 120 140 160
RGR, Gate Resistance ( ) G, Gate Resistance
TJ , Junction Temperature C ) (
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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5
IRG4PSC71UD
25
Total Switching Losses (mJ)
15
10
I C , Collector Current (A)
RG TJ VCC 20 VGE
= 5.0Ohm = 150 C = 480V = 15V
1000
VGE = 20V T J = 125 o C
100
10
5
0 20 40 60 80 100 120
SAFE OPERATING AREA
1 1 10 100 1000
I C , Collector Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
1000
Instantaneous forward current - IF (A)
100
10
TJ = 1 5 0 C TJ = 1 2 5 C TJ = 2 5 C
1 0.0 1.0 2.0 3.0
F o r w a rd V o lta g e D ro p - V F M (V )
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4PSC71UD
200 100
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
160
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
trr- (nC)
120
Irr- ( A)
10
80
I F = 30A I F = 60A I F = 120A
40
I F = 30A I F = 60A I F = 120A
1000 1 100
0 100
d i f /d t - (A / s)
1000
d i f /d t - (A / s )
Fig. 14 - Typical Reverse Recovery vs. dif/dt
4000
Fig. 15 - Typical Recovery Current vs. dif/dt
10000
VR = 2 0 0 V T J = 1 2 5 C TJ = 2 5 C
3000
VR = 20 0 V T J = 1 2 5 C T J = 2 5 C
di (rec) M/dt- (A /s)
Qrr- (nC)
I F = 3 0A I F = 6 0A I F = 1 20 A
2000
1000
I F = 120A I F = 60A I F = 30A
1000
0 100
d i f /d t - (A / s)
1000
100 100
1000
d i f /d t - (A / s)
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
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7
IRG4PSC71UD
Same type device as D .U.T.
90% V ge +V ge
V ce
80% of Vce
430F D .U .T.
Ic 10% V ce Ic 5% Ic td (off) tf 90% Ic
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
E off =
Vce Ic dt
t1+5 S V ce ic dt t1
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O LT A G E D .U .T . 10% + V g +V g
trr Ic
Q rr =
trr id dt Ic dt tx
tx 10% V c c Vce 10% Ic 90% Ic D U T V O LT A G E AND CURRENT Ipk Ic
10% Irr Vcc
V pk Irr
Vcc
D IO D E R E C O V E R Y W AVEFORMS td(on) tr 5% V c e t2 E on = V c e ieIc dt Vce dt t1 t2 D IO D E R E V E R S E RECOVERY ENERG Y t3 t4
E rec =
Vc Ic dt
t4 V d id dt t3
t1
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
8
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IRG4PSC71UD
V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T .
V O LT A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
L 1000V 50V 600 0 F 100 V Vc*
D.U.T.
RL= 0 - 480V
480V 4 X IC @25C
Figure 19. Clamped Inductive Load Test Circuit
Figure 20. Pulsed Collector Current Test Circuit
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9
IRG4PSC71UD
Notes:
Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20) VCC=80%(VCES), VGE=20V, L=10H, RG= 5.0 (figure 19) Pulse width 80s; duty factor 0.1% Pulse width 5.0s, single shot Current limited by the package, (Die current = 100A)
Case Outline and Dimensions -- Super-247
Dimensions are shown in millimeters
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936 http://www.irf.com/ Data and specifications subject to change without notice. 5/99
10
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